Wiring method and wiring apparatus

ABSTRACT

A wiring method is provided, in which a wire conductor is stuck on a surface of a substrate by causing a three-dimensional relative movement between a wiring head ( 2 ) for guiding the wire conductor ( 5 ) and the substrate ( 11 ) such that the wiring head relatively moves along an adhesive layer ( 12 ) on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact. A wiring apparatus for carrying out the wiring method includes a table ( 1 ) for supporting the substrate, a wiring head arranged for reciprocating motion between a close position in which the wiring head can be in point contact with the adhesive layer and a distant position in which the wiring head is most distant from the adhesive layer, and a moving mechanism ( 3 ) for causing a translational motion of the wiring head along the surface of the substrate under the control of a control section ( 4 ). The wire conductor is stuck onto the surface of substrate point by point, to be laid thereon, whereby a planar transformer, an antenna coil or a conductor pattern is formed on the substrate.

DESCRIPTION

[0001] 1. Technical Field

[0002] The present invention relates to a wiring method and a wiringapparatus, and more particularly, to a wiring method and a wiringapparatus capable of easily forming a coil on an insulating substrateand easily laying a wire conductor on a circuit board or circuitsubstrate. The present invention also relates to an IC cardmanufacturing method capable of easily manufacturing an IC card providedwith a chip module and/or an antenna coil, using the wiring methodand/or wiring apparatus of the above kind.

[0003] 2. Background Art

[0004] Recently, the demand to reduce the heights of various componentsinstalled in an electric apparatus has been increasing. To meet such ademand, a coil serving as a transformer, a filter or the like may beconfigured in the form of a so-called “planar coil”. The planar coil ofthis type is conventionally manufactured by subjecting a conductiveplate or film to etching or mechanical punching or by winding anenameled wire two-dimensionally. However, there are many problems thathinder manufacturing a planar coil of desired properties at low cost andwith high yield.

[0005] For example, according to the technique disclosed in JapanesePatent Preliminary Publication No. 57-136393, a wire conductor is laidin a desired pattern on an insulating substrate by moving a wiring headalong the insulating substrate, wherein the wire conductor heated inadvance using ultrasonic vibration is drawn out from the wiring head andembedded in an adhesive layer provided on a surface of the insulatingsubstrate. This technique, however, needs an expensive ultrasonicvibration machine for heating the wire conductor just before it is laidon the substrate. This makes a wiring apparatus complicated inconstruction and high in cost. Further, controlling the wire temperatureis very difficult. If the wire temperature varies, a uniform adhesion ofthe wire conductor to the adhesive layer cannot be attained, causing anincorrect conductor pattern.

[0006] According to the technique disclosed in Japanese PatentPreliminary Publication No. 8-294213, a patterned wire conductor placedon an insulating sheet is heated and pressed by a plate-shaped heatingunit, to be embedded in the insulating sheet. This technique helpsmanufacture the planar coil relatively easily, but needs a heating unitlarge enough to cover the entirety of the patterned wire conductor.Further, even with such a large heating unit, it is difficult to heatthe entirety of the patterned wire conductor uniformly at a time. If thepatterned wire conductor is not heated uniformly, the wire conductorcannot be uniformly embedded in the insulating sheet, and, for example,part of the wire conductor rises from the insulating sheet. This maycause deformation and/or breakage of the patterned wire conductor.

[0007] Recently, an IC card having an information-processing functionhas come into widespread use. Particularly, an IC card accommodatingtherein an antenna coil for wireless communication with an externalinformation processing apparatus is attracting attention. An antennacoil of the IC card of this type is formed on a card substrate andcovered with a protective layers. Generally, the antenna coil is formedby etching a copper-foiled card substrate. However, this method requiresa complicated process for making an antenna coil, and makes it difficultto form an antenna coil composed of coil parts or coil sections arrangedat a sufficiently high density, because adjacent coil parts can beshort-circuited if the spacing therebetween is small. The coil partseach have a circular or rectangular shape and arranged as a whole in aspiral form to constitute the antenna coil. Thus, the antenna coilformed by etching is not satisfactory in respect of antennacharacteristics and manufacturing cost.

[0008] Alternatively, an antenna coil may be formed by plating orprinting. With these techniques, however, it is generally difficult toprovide an antenna coil with a thick conductor, posing problems inrespect of the bending strength and tensile strength of the antennacoil, as well as the strength and reliability of the antenna coilmounted to an IC card.

[0009] As for the production of an antenna coil, it is known to soften acard substrate by hot air and embed a wire conductor into a surfaceportion of the softened card substrate, or to heat a wire conductor inadvance with frictional heat generated by ultrasonic vibration and embedthe heated wire conductor into a surface portion of a card substrate.However, these methods require severe control of hot air temperature andconductor heating temperature, respectively. When ultrasonic vibrationis used, an expensive ultrasonic vibrator is required, which causes anincreased equipment cost and fatigue breakage of a wire conductorattributable to ultrasonic vibration.

DISCLOSURE OF THE INVENTION

[0010] An object of the present invention is to provide a wiring methodand a wiring apparatus capable of laying a wire conductor easily andprecisely in the process of manufacturing a planar transformer, acircuit board, or the like.

[0011] Another object of the present invention is to provide an IC cardmanufacturing method capable of manufacturing an IC card provided with achip module or an antenna coil, with ease and high reliability and atlow cost, using the wiring method and wiring apparatus mentioned above.

[0012] In order to attain the above object, according to one aspect ofthe present invention, there is provided a wiring method comprising thesteps of (a) forming an adhesive layer on a surface of a substrate, and(b) sticking a wire conductor on the surface of the substrate by causinga three-dimensional relative movement between the substrate and a wiringhead adapted to guide the wire conductor such that the wiring headrelatively moves along the adhesive layer formed on the surface of thesubstrate and the wiring head and the adhesive layer intermittently comeclose to each other for point contact.

[0013] In the wiring method of this invention, during thethree-dimensional relative movement between the wiring head and thesubstrate, the wiring head intermittently comes close to the adhesivelayer formed on the surface of the substrate for point contacttherewith, so that the wire conductor supplied to and guided by thewiring head may be pressed between the wiring head and the adhesivelayer formed on the substrate surface, to be stuck at a point on thesubstrate surface. Thus, the wire conductor is stuck on the substratesurface, point by point (point to point), securely and uniformly, like athread fastened stitch by stitch by a sewing machine. The wire conductoris easily laid with high sticking strength and with uniformity only byrelatively moving the wiring head and the substrate in three dimensions,so that the possibility of the wire conductor being deformed or brokenafter it is laid on the substrate may be reduced. As the adhesive layer,an adhesive layer having adhesiveness in an ordinary temperature or apressure sensitive adhesive layer exhibiting adhesiveness when apressure is applied by the wiring head is desirable. In the presentinvention, the wire conductor does not need to be heated before it islaid, making it possible to avoid increased cost due to the provision ofheating means, severe control of heating temperature for the wireconductor, and unevenness in sticking the wire conductor on thesubstrate caused by unsuitable control of heating temperature. Further,the wiring method of this invention has little restriction about thekind of wire conductor and the pattern of relative movement between thewiring head and the substrate, which pattern closely relates to thewiring pattern. Therefore, a desired wire conductor can be laid in adesired wiring pattern, thereby making it possible to manufacture aplanar transformer of desired properties, for instance.

[0014] Desirably, the three-dimensional relative movement between thewiring head and the substrate executed in the step (b) includes arelative translational motion between the wiring head and the substratewhich is performed along the adhesive layer, and a relative reciprocalmotion between the wiring head and the substrate which is performed in adirection of thickness of the substrate.

[0015] With this desirable method, the three-dimensional relativemovement is carried out as a combination of the relative translationalmotion (two-dimensional relative motion) and the relative reciprocalmotion which can be executed independently of each other. Therefore, thethree-dimensional relative movement can be made with use of a relativelysimple wiring apparatus and under a relatively simple control process.The relative translational motion can be made without interruption. Forthe relative translational motion, the movement of the wiring headand/or the substrate is controlled, for example, by a route controltechnique or a point-to-point control technique.

[0016] Desirably, the relative translational motion between the wiringhead and the substrate is executed in association with the relativereciprocal motion therebetween.

[0017] The wire conductor to be laid on the surface of the substrate iscomprised of a series of wire conductor sections which are continuouswith one another. Each wire conductor section can be defined, forexample, as corresponding to that part of the wire conductor which isdrawn out from the wiring head in one cycle of the relative reciprocalmotion. The relative reciprocal motion consists of a receding motionfrom a close position in which the wiring head and the adhesive layerare close to each other for point contact to a distant position in whichthe wiring head and the adhesive layer are most distant from each other,and an approaching motion from the distant position to the closeposition. The relative reciprocal motion is executed for each wireconductor section. The relative translational motion can be defined asbeing comprised of a series of relative translational motions performedfor the series of wire conductor sections. The relative translationalmotion for each wire conductor section is carried out in associationwith the relative reciprocal motion. For example, it is preferable thatthe relative translational motion for each wire conductor section startswhen the receding motion starts, and ends when the approaching motionends.

[0018] In this desirable method, when the receding motion between thewiring head and the substrate is started, the relative translationalmotion between the wiring head and the substrate is started. During theperiod from the start of the receding motion to the end of theapproaching motion, a given one of the wire conductor sections is drawnout from the wiring head, and the relative translational motion betweenthe wiring head and the substrate is terminated. With this relativetranslational motion, the wire conductor section is laid on the adhesivelayer formed on the substrate surface. At the terminal end of the wireconductor section, the wire conductor is pressed between the wiring headand the adhesive layer formed on the surface of the substrate due to theapproaching motion, to be stuck on the surface of the substrate. For theseries of wire conductor sections, these conductor sections are disposedand stuck in sequence on the substrate surface. The wire conductor isstuck thereon point by point at respective borders between adjacentpairs of wire conductor sections. The series of relative translationalmotions is executed by controlling the two-dimensional movement, e.g.,of the wiring head or the substrate by a point-to-point controltechnique. The wiring head and/or the substrate move continuously inappearance, with a short intermission at the border between adjacentwire conductor sections.

[0019] Desirably, while a head body of the wiring head and the substrateare disposed to be spaced from each other, a pressing member movablyattached to the head body and the adhesive layer formed on the surfaceof the substrate are caused to contactably close to each other. In thiscase, the pressing member prevents the wire conductor section alreadystuck on the surface of the substrate from peeling therefrom.

[0020] In the present invention, desirably, the wire conductor suppliedto the wiring head is drawn out from the wiring head by thethree-dimensional relative movement between the wiring head and thesubstrate executed in the step (b).

[0021] With this desirable method, since the wire conductor is drawn outby the three-dimensional relative movement between the wiring head andthe substrate in the step (b), a step of forcedly feeding the wireconductor from the wiring head by using feeding means is not needed.

[0022] Desirably, the wiring method of this invention further comprisesthe steps of (c) providing a second adhesive layer on the wire conductorstuck on the surface of the substrate, and (d) sticking a second wireconductor on the second adhesive layer by causing a three-dimensionalrelative movement between the substrate and the wiring head adapted toguide the second wire conductor, such that the wiring head relativelymoves along the second adhesive layer and the wiring head and the secondadhesive layer intermittently come close to each other for pointcontact.

[0023] With this desirable method, wire conductors of the same kind ordifferent kinds can be laid in layers on the substrate.

[0024] More desirably, the three-dimensional relative movement betweenthe wiring head and the substrate executed in the step (b) includes arelative translational motion between the wiring head and the substratewhich is performed along the adhesive layer, and a relative reciprocalmotion between the wiring head and the substrate which is performed in adirection of thickness of the substrate. The relative translationalmotion is executed in accordance with a first two-dimensional pattern,so that a first wire-conductor pattern corresponding to the firsttwo-dimensional pattern is formed on the surface of the substrate.Further, in the step (c), the second adhesive layer is formed on thefirst wire-conductor pattern. In the step (d), a relative translationalmotion between the substrate and the wiring head adapted to guide thesecond wire conductor is executed in accordance with a secondtwo-dimensional pattern, so that a second wire-conductor patterncorresponding to the second two-dimensional pattern is formed on thesecond adhesive layer.

[0025] With this desirable method, wire conductors of the same kind ordifferent kinds can be laid in layers in the same pattern or differentpatterns on the substrate.

[0026] Desirably, in the step (c), an adhesive sheet, for example, adouble-sided adhesive sheet, is stuck on the first wire-conductorpattern to form the second adhesive layer.

[0027] This desirable method is convenient in sticking the secondadhesive layer at its one side on the adhesive layer provided on thesurface of the substrate, with the first wire-conductor patterninterposed therebetween, and in forming the second wire-conductorpattern on the other side of the second adhesive layer.

[0028] Desirably, conductors with an insulating coating such as enameledwires (wires with an enamel coating) are used as the wire conductor andthe second wire conductor.

[0029] With this desirable method, the wire conductor and the secondwire conductor or the first wire-conductor pattern and the secondwire-conductor pattern can be arranged to extend across each other,without an electrical insulator interposed therebetween. Further, thewire conductors or the wire-conductor patterns can be electricallyconnected to an external element easily by drawing their ends to theoutside, without the need of forming through-holes in the substrate.Further, when the wire conductor or the second wire conductor is to beformed in the shape of a coil, the wire conductor or the second wireconductor can be laid in dense, if necessary, by densely arranging coilsections of the wire conductor one another. Thus, this desirable methodis useful, for example, in forming an antenna coil having excellentantenna characteristics.

[0030] According to another aspect of the present invention, there isprovided a wiring apparatus comprising a supporting mechanism forsupporting a substrate having a surface thereof provided with anadhesive layer; a wiring head for guiding a wire conductor, the wiringhead being arranged for reciprocal motion between a close position inwhich the wiring head can be in point contact with the adhesive layerformed on the surface of the substrate and a distant position in whichthe wiring head is most distant from the adhesive layer; a movingmechanism for causing a relative translational motion between the wiringhead and the substrate such that the wiring head relatively moves alongthe surface of the substrate; and control means for controlling anoperation of the moving mechanism.

[0031] With the wiring apparatus of the present invention, the wiringhead is reciprocated between the close position and the distant positionand is caused by the moving mechanism operated under the control of thecontrol means to make a relative translational motion in relation to thesubstrate so as to relatively move along the surface of the substrate,whereby the wiring head comes close to the adhesive layer formed on thesubstrate surface each time it assumes the close position. Thus, withuse of a relatively simple apparatus arrangement such as to cause therelative translational motion between the substrate and the wiring headthat is movable in the directions toward and away from the substratesurface, the wiring head can be intermittently brought close to theadhesive layer for point contact therewith to press the wire conductorbetween itself and the adhesive layer, whereby the wire conductor can bestuck on the surface of the substrate securely. Further, the wiringapparatus of the present invention has little restriction about the kindof wire conductor, making it possible to lay a desired wire conductor onthe substrate.

[0032] Desirably, the control means controls the operation of the movingmechanism in accordance with a wiring pattern for laying the wireconductor on the substrate.

[0033] With this desirable apparatus, the wiring head is caused by themoving mechanism, operable under the control of the control means, tomake the relative translational motion in relation to the substrate inaccordance with the wiring pattern, so that the wire conductor guided bythe wiring head is laid in the wiring pattern.

[0034] In the wiring apparatus of the present invention, desirably, thewiring head has a nozzle for guiding the wire conductor, and when thewiring head is in the close position, a tip of the nozzle is positionedclose to the adhesive layer formed on the surface of the substrate forpoint contact therewith.

[0035] With this desirable apparatus, while the wire conductor is beinglaid, the tip of the nozzle intermittently comes close to the adhesivelayer formed on the surface of the substrate for point contacttherewith, whereby the wire conductor drawn out from the tip of thenozzle of the wiring head is pressed between the wiring head and theadhesive layer, to be stuck on the surface of the substrate securely.

[0036] Desirably, the wiring head has a nozzle having a nozzle hole forguiding the wire conductor, and the nozzle hole extends parallel to thedirection of reciprocation of the wiring head.

[0037] In this desirable apparatus, while the wiring head recedes fromthe close position to the distant position, the wire conductor passingthrough the nozzle hole is drawn out from the wiring head. The relativetranslational motion between the wiring head and the substrate isassociated with the reciprocal motion of the wiring head, for example,as follows: After the wiring head reaches the distant position to causethe wire conductor to be drawn out from the wiring head, the relativetranslational motion is made between the wiring head and the substrate,so that the wire conductor is disposed on the surface of the substrate.Then, the wiring head and the adhesive layer formed on the surface ofthe substrate are moved to close to each other, whereby the wireconductor is pressed between the wiring head and the adhesive layer, tobe stuck to the surface of the substrate. With this desirable apparatus,the wire conductor can be drawn out from the wiring head and laidsecurely, without using a device for forcedly feeding the wire conductorfrom the wiring head.

[0038] Desirably, the moving mechanism includes a first table arrangedfor reciprocal motion relative to the supporting mechanism, and a secondtable for supporting the wiring head, the second table being arrangedfor reciprocal motion in a direction perpendicular to an axis alongwhich the first table is reciprocated.

[0039] With this desirable aspect, the moving mechanism for causing therelative translational motion of the wiring head in relation to thesurface of the substrate can have a simple structure.

[0040] Desirably, the wiring head includes a supporting portion mountedto the moving mechanism, a shaft portion supported for reciprocal motionby the supporting portion, a nozzle for guiding the wire conductor, thenozzle being attached to the shaft portion on a side thereof facing thesurface of the substrate, an eccentric cam rotatably supported by thesupporting portion, and a cam follower attached to the shaft portion ona side thereof remote from the surface of the substrate and disposed incontact with a cam face of the eccentric cam.

[0041] With this desirable apparatus, the shaft portion and the nozzleof the wiring head can be reciprocated relative to the substrate surfaceby rotating the eccentric cam.

[0042] More desirably, a plurality of nozzles are detachably attached tothe shaft portion of the wiring head. In this case, from among theplurality of nozzles attached to the wiring head, a nozzle suitable forthe kind of a wire conductor to be laid on the substrate can be selectedfor use. Further, the nozzles can be replaced if necessary.

[0043] Alternatively, the wiring head includes a head body mounted tothe moving mechanism, a nozzle for guiding the wire conductor, thenozzle being supported by the head body for reciprocal motion and forpoint contact with the adhesive layer formed on the surface of thesubstrate, a pressing member supported by the head body for reciprocalmotion and for point contact with the adhesive layer, a first and secondpermanent magnets attached to the nozzle and the pressing member,respectively, and having different directions of magnetism, and anelectromagnet attached to the head body for electromagnetic interactionwith the first and second permanent magnets.

[0044] In this desirable apparatus, when an alternating current issupplied to the electromagnet, the nozzle and the pressing member of thewiring head are caused to move in the opposite directions toward andaway from the substrate surface due to the electromagnetic interactionbetween the electromagnet and the first and second permanent magnets.While the wire conductor is being laid, the nozzle and the adhesivelayer formed on the substrate surface intermittently come close to eachother for point contact to press the wire conductor therebetween,whereby the wire conductor is stuck on the surface of the substratesecurely. Further, as the nozzle and the adhesive layer are moved awayfrom each other, the pressing member and the adhesive layer are movedclose to each other, thereby pressing the wire conductor disposed on theadhesive layer therebetween, so as to prevent the wire conductor havingbeen stuck on the substrate surface from separating therefrom.Desirably, the nozzle is detachably attached to the head body and can bereplaced with another nozzle, depending on the kind of a wire conductorto be laid.

[0045] According to another aspect of the present invention, there isprovided an IC card manufacturing method comprising the steps of (a)sticking an electrical component on an adhesive sheet; (b) laying a wireconductor on the adhesive sheet by causing a relative movement betweenthe adhesive sheet and a wiring head adapted to guide the wire conductorsuch that the wiring head relatively moves along a surface of theadhesive sheet and the wiring head and the adhesive sheet intermittentlycome close to each other for point contact; (c) electrically connectingeach end of the wire conductor to the electrical component; and (d)sticking the adhesive sheet and a card substrate together.

[0046] In the IC card manufacturing method of the present invention,when the wire conductor is to be laid on the card substrate, neither thecard substrate nor the wire conductor needs to be heated. Thus, increaseof cost due to the use of heating means, severe control of heatingtemperature, and fatigue breakage of the wire conductor due to heatingby ultrasonic vibration can be avoided, therefore, IC cards can bemanufactured easily, with high reliability and at low cost.

[0047] In the IC card manufacturing method of the present invention,desirably, in the step (d), a first card substrate is stuck on thatfirst surface of the adhesive sheet on which the electrical component isstuck, and a second card substrate is stuck on a second surface of theadhesive sheet.

[0048] With this desirable method, a protection can be provided for theelectrical component stuck on and the wire conductor laid on theadhesive sheet by sandwiching the electrical component and the wireconductor between the first and second card substrates.

[0049] More desirably, in the step (a), the electrical component isstuck on an exposed first adhesive surface of a double-sided adhesiveinsulating sheet having a second adhesive surface thereof provided witha separating sheet. In the step (b), the wire conductor is laid on theexposed first adhesive surface of the double-sided adhesive sheet. Inthe step (d), the first card substrate is stuck on the exposed firstadhesive surface of the double-sided adhesive sheet, the separatingsheet is separated from the second adhesive surface of the double-sidedadhesive sheet, and then the second card substrate is stuck on thesecond adhesive surface.

[0050] With this desirable method, the first and second card substratescan be stuck on the double-sided adhesive sheet, making use of theadhesiveness thereof. Thus, the sticking step (b) can be carried outeasily.

[0051] In the IC card manufacturing method of the present invention,desirably, in the step (b), an antenna coil is formed on the adhesivesheet by laying the wire conductor in a predetermined pattern on theadhesive sheet.

[0052] In this desirable method, the antenna coil is formed of the wireconductor laid on the adhesive sheet, through a relative movementbetween the wiring head and the adhesive sheet. The laying step haslittle restriction about the kind of wire conductor to be laid and therelative movement between the wiring head and the adhesive sheet for thelaying step can be controlled precisely. Thus, for example, by using ancopper wire with an enamel coating as the wire conductor, coil sectionsof the wire conductor, each of which has a circular or rectangular shapeand which are disposed as a whole into a spiral form, are arranged at ahigh density while ensuring the insulation between adjacent coilsections, whereby the antenna characteristics of an antenna coil can beimproved, and therefore, an IC card accommodating therein an antennacoil of desired antenna characteristics and adapted for wirelesscommunication can be provided.

[0053] Desirably, in the step (a), at least one of a semiconductor chip,a chip resistor, a chip capacitor and a terminal is stuck on theadhesive sheet as the electrical component.

[0054] With this desirable method, by sticking desired electricalcomponents on the adhesive sheet, an IC card having desired capabilitycan be manufactured.

[0055] Desirably, in the step (a), a plurality of electrical componentsare stuck on the adhesive sheet; in the step (b), at least one electricwiring pattern is formed on the adhesive sheet by laying the wireconductor in a predetermined pattern on the adhesive sheet; and in thestep (c), the electric wiring pattern is electrically connected withrelevant ones of the plurality of electrical components.

[0056] With this desirable aspect, the electrical components can beconnected via the electric wiring pattern formed of the wire conductor.Thus, the IC card can be manufactured easily.

BRIEF DESCRIPTION OF THE DRAWINGS

[0057]FIG. 1 is a schematic perspective view of a wiring apparatusaccording to a first embodiment of the present invention;

[0058]FIG. 2 is a schematic plan view showing how a wire conductor islaid with use of the wiring apparatus shown in FIG. 1;

[0059]FIG. 3 is a schematic view showing partly in cross section awiring head shown in FIG. 1,

[0060]FIG. 4 is a schematic cross-sectional view of another wiring head;

[0061]FIG. 5A is a schematic perspective view showing a step of formingan adhesive layer on a first core as a substrate in the process ofmanufacturing a planar transformer;

[0062]FIG. 5B is a schematic perspective view showing a step of laying awire conductor on the adhesive layer;

[0063]FIG. 5C is a schematic perspective view showing a step of forminga second adhesive layer on the wire conductor;

[0064]FIG. 5D is a schematic perspective view showing a step of laying asecond wire conductor on the second adhesive layer;

[0065]FIG. 5E is a schematic perspective view showing a step of mountinga second core on the first core;

[0066]FIG. 5F is a schematic perspective view showing a step ofcombining the first and second cores together;

[0067]FIG. 6A is a schematic plan view showing an example of a planarcoil pattern;

[0068]FIG. 6B is a schematic plan view showing another example of aplanar coil pattern;

[0069]FIG. 6C is a schematic plan view showing another example of aplanar coil pattern;

[0070]FIG. 6D is a schematic plan view showing another example of aplanar coil pattern;

[0071]FIG. 7 is an illustration showing an example where two planarcoils are formed on the same substrate;

[0072]FIG. 8A is a schematic perspective view showing a step of stickingan electrical component and laying a wire conductor on an adhesive sheetin an IC card manufacturing method according to a second embodiment ofthe present invention;

[0073]FIG. 8B is a schematic perspective view showing a step ofconnecting the electrical component and the wire conductor;

[0074]FIG. 8C is a schematic perspective view showing a step of stickinga first card substrate on the adhesive sheet;

[0075]FIG. 8D is a schematic perspective view showing a step ofseparating a separating sheet from the adhesive sheet; and

[0076]FIG. 8E is a schematic perspective view showing a step of stickingthe first and second card substrates on the adhesive sheet.

BEST MODE OF CARRYING OUT THE INVENTION

[0077] With reference to the drawings, a wiring apparatus according to afirst embodiment of the present invention will be described below.

[0078] In FIG. 1, the wiring apparatus of the present embodiment isadapted to lay a wire conductor 5 on the surface of a substrate 11. Thefollowing description will mainly explain the case where the wireconductor 5 is laid in the shape of a coil to form a planar coil.

[0079] The substrate 11 is a flexible film comprising a base ofpolyester, polyimide or the like and shaped into the form of a tape or asheet (so-called adhesive tape). On the surface of the substrate 11, anadhesive layer 12 such as a thermosetting rubber adhesive layer, anacrylic adhesive layer, a silicone adhesive layer or the like is formed.The substrate 11 may be an insulating substrate with an adhesive layer12 formed on the surface thereof. It is desirable that the adhesivelayer 12 has a certain adhesive strength in an room temperature. As thewire conductor 5, a suitable one satisfying the requirements of a planarcoil, wiring pattern or the like is chosen from among a bare copperwire, an enameled wire having an insulating coating of synthetic resinon a copper wire (enameled copper wire having a round or rectangularshape in cross section), a litz wire consisting of a plurality ofenameled wires twisted together, and the like.

[0080] As shown in FIG. 1, a wiring apparatus includes a table 1functioning as a supporting mechanism for supporting the substrate 11, awiring head 2 for guiding the wire conductor 5 which is continuously fedfrom a feed reel 15 through a feed unit including a tensioner 13, feedrollers 14 and the like, a moving mechanism 3 for supporting and movingthe wiring head 2 along the surface of the substrate 11, and a controlsection 4 for controlling the operation of the moving mechanism 3.

[0081] Specifically, the moving mechanism 3 includes a base 3 a locatedlaterally of the table 1, a first table 3 b arranged on the base 3 a forreciprocal motion in the longitudinal direction of the substrate 11 (inX-axis direction), and a second table 3 c arranged on the first table 3b for reciprocal motion in the width direction of the substrate 11 (inY-axis direction). On the second table 3 c, a supporting arm 21 of thewiring head 2 is fixed. The first and second tables 3 b, 3 c are eachdriven by a table driving section including an actuator such as a motor.Since the table driving section 3 is conventionally known, theillustration and explanation thereof will be omitted. The movingmechanism 3 is arranged to move the wiring head 2 along the surface ofthe substrate 11 two-dimensionally (in a plane) under the control of thecontrol section 4 including a micro processor.

[0082] In place of the table 1, a conveyor for conveying the substrate11 at a fixed speed may be used as the supporting mechanism. Further, inplace of the feed unit having a function of feeding the wire conductor,a guide unit for simply guiding the wire conductor may be locatedbetween the reel 15 and the wiring head 2.

[0083] The wiring head 2 is driven by the moving mechanism 3 to move inan XY plane, and is arranged for reciprocal motion in the thicknessdirection of the substrate 11 or for up-and-down motion, so that the tipof a nozzle of the wiring head is caused to intermittently come close tothe substrate surface for point contact therewith, whereby the wireconductor 5 fed from the tip of the nozzle is laid on the surface of thesubstrate 11. As described later, under the control of the controlsection 4, the up-and-down motion of the wiring head 2 is performed inassociation with the two-dimensional movement of the wiring head causedby the moving mechanism 3.

[0084] As shown in FIGS. 1 and 3, the wiring head 2 includes asupporting arm 21 fixed to the moving mechanism 3, and a shaft portion23 supported by the supporting arm 21 through thrust bearings 22 forup-and-down motion. Two nozzles 24 for guiding the wire conductor 5 aredetachably attached at the opposite ends of a lower bracket portion ofthe shaft portion 23. The two nozzles 24 have nozzle holes suited toguide wire conductors 5 of different wire diameters. Thus, one of thetwo nozzles 24 can be selectively used, for example, depending on thekind of wire conductor 5. If necessary, the nozzles 24 can be replacedwith other appropriate nozzles.

[0085] A cam follower 26 in the shape of a rectangular ring is providedat the upper end of the shaft portion 23, and an eccentric cam 25 isarranged inside the cam follower 26 so that the cam face may be incontact with the inner face of the cam follower. The shaft portion 25 aof the eccentric cam 25 is rotatably supported, for example, by thesupporting arm 21, and coupled to a motor (not shown). As the motorrotates, the eccentric cam 25 rotates, so that the cam follower 26, theshaft portion 23, and the nozzle 24 move up and down together, and thetip of the nozzle 24 comes into contact with the surface of thesubstrate 11, intermittently. The stroke of the up-and-down motion ofthe nozzle 24 (wiring head 2) is arranged, for example, to be about 1-2mm when a conductor 5 of 0.3 mm in diameter is to be laid. The frequencyor cycle of the up-and-down motion of the nozzle 24 (wiring head 2) maybe arranged in view of the speed of laying the wire conductor. It isarranged, for example, to be about 50 Hz.

[0086]FIG. 4 shows another example of wiring head structure. The wiringhead 2′ shown in FIG. 4 has a head body 31, which is fixed to the secondtable 3 c of the moving mechanism 3. Inside the head body 31, acylindrical nozzle 32, a cylindrical pressing member 33 for preventingthe wire conductor 5 that has been laid on the surface of the substratefrom rising, and an electromagnet 34 are arranged. The nozzle 32 extendsover the entire height of the head body 31, and is supported by headbody 31 through the pressing member 33 so as to be movable up and down.Around an upper end portion of the nozzle 32, a ring-shaped permanentmagnet 35, 36 is fitted. The pressing member 33 extends up to the bottomof the head body 31 underneath the electromagnet 3, and is supported bythe head body 31 for up-and-down motion. Around an upper end portion ofthe pressing member 33, a ring-shaped permanent magnet 36 is fittedhaving a different direction of magnetism from that of the permanentmagnet 35, 36.

[0087] The wiring head 2′ is arranged to cause the nozzle 32 and thepressing member 33 to reciprocate vertically by means of theelectromagnet 34 attracting and repelling the permanent magnets 35, 36.Specifically, when the electric current is supplied to the electromagnet34 to magnetize the electromagnet 34 such that a north pole is at thelower face of the electromagnet, the nozzle 32 and the pressing member33 are attracted by the electromagnet 34. As a result, the pressingmember 33 is drawn up into the head body 31, while the nozzle 32projects from the lower faces of the head body 31 and the pressingmember 31 as indicated by a two-dot-line in FIG. 4. At that time, thenozzle 32 comes close to the adhesive layer 12 on the surface of thesubstrate 11 to the extent that the nozzle 32 can come into contacttherewith, and the wire conductor 5, which is fed from the tip of thenozzle 32, is pressed onto the adhesive layer 12 by the nozzle 32 andstuck on the surface of the substrate. On the other hand, when theelectric current is supplied to the electromagnet 34 in the oppositedirection to magnetize the electromagnet 34 such that a north pole is atthe upper face of the electromagnet, the electromagnet 34 and thepermanent magnets 35, 36 repel each other. As a result, the nozzle 32 isdrawn up into the head body 31 as indicated by a solid line in FIG. 4,while the pressing member 33 projects from the lower faces of the headbody 31 and the nozzle 32. At that time, the pressing member 33 presses,with its tip end, the wire conductor 5 that has been laid on thesubstrate 11 and prevents the wire conductor 5 from rising from thesurface of the substrate.

[0088] With the wiring head 2′ shown in FIG. 4, the nozzle 32 can bemoved up and down at a speed higher than that of the wiring head 2 shownin FIG. 3 and causing the nozzle 24 to move up and down mechanically bymeans of the eccentric cam 25. Therefore, the speed of laying a wireconductor can be increased. Further, the wiring head 2′ can lay the wireconductor 5, preventing the wire conductor 5 from rising by means of thepressing member 33. Therefore, the wire conductor 5 can be stuck on thesurface of the substrate securely and reliably.

[0089] The wiring apparatus is arranged to cause the wiring head 2 or 2′to move up and down and to make a translational motion along the surfaceof the substrate in accordance with a predetermined two-dimensionalmotion pattern by means of the moving mechanism 3 operated under thecontrol of the control section 4. When the wiring head 2 or 2′ moves upand down, the wiring head reciprocates between a close position in whichthe tip of the nozzle is close to the adhesive layer 12 provided on thesurface of the substrate to the extent that it can be in point contactwith the adhesive layer 12, and a distant position in which the tip ofthe nozzle is most distant from the surface of the substrate.

[0090] Next, the operation of the wiring apparatus with the wiring head2 will be described.

[0091] In the process of laying the wire conductor 5 on the surface ofthe substrate 11, when the wiring head 2 moves down to the closeposition where the tip of the nozzle can be in point contact with theadhesive layer 12 formed on the substrate surface, the wire conductor 5fed from the tip of the nozzle is strongly stuck, via the adhesive layer12, to the surface of the substrate 11 locally or in spot at itspoint-contact portion. Then, the wiring head 2 starts moving up, and thewire conductor 5 is drawn out (fed) from the tip of the nozzle by thelength corresponding to the distance for which the wiring head 2 movesup. In the period from the time the wiring head 2 starts moving up tothe time the wiring head 2 moves down to the close position again, oneor both of the first and second tables 3 b, 3 c of the moving mechanism3 move in a direction determined by the wiring pattern for a distancedetermined by the wiring pattern, so that the wiring head 2 moves alongthe substrate surface linearly or two-dimensionally. After the wiringhead 2 moves that way, the tip of the nozzle of the wiring head 2 againcomes into point contact with the adhesive layer 12, with the wireconductor 5 interposed therebetween, and the conductor 5 is stronglystuck to the substrate surface locally on that point-contact spot. Asmentioned above, that portion of the wire conductor 5 (one wireconductor section) which has been drawn out from the wiring head 2 bythe upward movement of the wiring head 2 is disposed on the adhesivelayer 12 on the substrate surface by the linear or two-dimensionalmovement and the downward movement of the wiring head 2, so as to extendfrom the point-contact spot for the preceding cycle to the spot for thepresent cycle. On each point-contact spot, the wire conductor 5 isstrongly stuck. As a result, the wire conductor 5 is stuck on thesubstrate surface via the adhesive layer 12 by the length correspondingto one wire conductor section.

[0092] For a series of wire conductor sections, the operation of layingand locally and strongly sticking the wire conductor 5 on the substratesurface is carried out in sequence by means of the up-and-down movementof the wiring head 2 and the horizontal movement of the wiring head 2caused by the moving mechanism 3 in accordance with a wiring pattern. Asa result, the wire conductor 5 is stuck on the substrate surface in apredetermined wiring pattern, like a thread is fastened stitch by stitchby a sewing machine. In FIG. 2, reference signs P1, P2, P3 anddashed-line circles denote point-contact spots where the tip of thenozzle of the wiring head 2 and the adhesive layer 12 are in pointcontact with each other via the wire conductor 5 (i.e., local positionsat which the wire conductor 5 is strongly stuck on the substrate surfacevia the adhesive layer 12).

[0093] With the above-described wiring apparatus, each time the tip ofthe nozzle of the wiring head 2 comes into point-contact with thesubstrate surface intermittently, the wire conductor 5 is strongly stuckon the substrate surface at its point-contact portion, so that the wireconductor 5 is extended securely between adjacent wire-conductorsticking points. While the movement of the wiring head 2 is controlledin accordance with a predetermined wiring pattern, the wire conductor 5drawn out from the tip of the nozzle of the wiring head 2 by means ofthe up-and-down motion of the wiring head 2 is strongly stuck on thesubstrate surface point by point, whereby the wire conductor is laid onthe surface of the substrate in wiring pattern. As a result, a planarcoil with a desired coil pattern can be formed easily with highprecision.

[0094] In particular, according to the wiring apparatus continuouslylaying the wire conductor 5 simply by sticking the conductor 5 locallyat predetermined intervals on the adhesive layer 12 provided on thesubstrate surface and exhibiting adhesiveness, for example, in anordinary temperature, the wire conductor 5 is not required to be heatedin advance, unlike the conventional apparatus, so that the apparatusarrangement can be much simplified in construction. In addition, sincethe horizontal movement of the wiring head 2 is started after the wiringhead 3 moves up to be apart from the substrate surface, the horizontalmovement is never hindered by the adhesiveness of the adhesive layer 12.Specifically, according to the conventional apparatus in which a wireconductor heated in advance is laid on a substrate, the laying of thewire conductor is continuously made by horizontally moving the wiringhead while keeping the tip of the nozzle of the wiring head to be incontact with the substrate surface, like a picture being drawn with onestroke. In this case, if the adhesive layer shows adhesiveness in anordinary temperature, the horizontal movement of the tip of the nozzleis hindered by the adhesiveness. By contrast, the wiring head 2 of thepresent apparatus, which is adapted for intermittent point contact withthe substrate while making the vertical reciprocal movement, is enabledto make a smooth horizontal movement, whereby the wiring pattern can beformed with high precision.

[0095] As for the combinations of the substrate 11 and the wireconductor 5 shown in table 1, the present inventors carried outexperiments in which the wiring head 2 was caused to move horizontallyin accordance with a wiring pattern while making an up-and-down motionat a frequency of 50 Hz. With each combination, a satisfactory planarcoil was obtained. That is, it was ascertained that the wire conductorwas able to be laid satisfactorily without any problem, even when thehorizontal movement of the wiring head 2 was made synchronuously withthe up-and-down motion, if the up-and-down motion of the wiring head 2was made at a frequency on the aforementioned order at which it takesonly a very short time for the wire conductor 5 to be strongly andlocally stuck on the substrate 11 by the wiring head TABLE 1 ExampleSubstrate 11 Conductor 5 1 Adhesive tape with an Grade 2 polyurethaneadhesive layer of enameled wire (wire thermosetting rubber diameter:0.07 mm) (Polyester tape #UL58 manufactured by Sumitomo 3M) 2 Adhesivetape with an Bare copper wire (wire adhesive layer of silicone diameter:0.3 mm) (Polyester tape #336 manufactured by Nittoh Denkoh) 3 Adhesivetape with an Litz wire consisting of 7 adhesive layer of silicone Grade2 polyurethane (Polyester tape #646S enameled wires strandedmanufactured by Teraoka together, each enameled Seisakusho) wire being0.1 mm in wire diameter 4 Adhesive tape with an Flat wire coated withadhesive layer of polyester of 0.07 mm × thermosetting silicone 1.4 mm ×1.4 mm (Polyester tape #UL92 manufactured by Sumitomo 3M) 5 Adhesivetape with an Triple insulated winding adhesive layer of wire of 0.3 mmin diameter thermosetting silicone (The wire is flattened by (Polyestertape #UL92 thermal pressing after it manufactured by Sumitomo 3M) islaid)

[0096] Next, referring to FIGS. 5A to 5F, an example of a planartransformer manufactured with the above-described wiring apparatus willbe described.

[0097] In the process of manufacturing the planar transformer, as shownin FIG. 5A, a first ferrite core 51 in the shape of a square frame-likeflat plate, serving as a substrate 11, is first provided on aglass-epoxy substrate 40, for example. The first ferrite core 51 servesto constitute part of a core of a planar transformer. Next, as anadhesive layer 12 provided on the surface of the substrate, adouble-sided adhesive tape 52 such as one manufactured by TeraokaSeisakusho [#7021 or #769] is stuck on the upper surface of the firstferrite core 51. In FIGS. 5A to 5F, reference numeral 41 denotes aplurality of connecting terminals that are provided at side edgeportions of the glass-epoxy substrate 40 in advance.

[0098] Then, as shown in FIG. 5B, a wire conductor 5, for example, a 0.1mm UEW that is a copper wire with an insulating coating is laid on theadhesive layer 52 in a predetermined coil pattern, thereby forming aprimary coil 53. After the primary coil 53 is laid, the terminal endportion of the conductor 5 is extended across the patterned coil to theoutside of the substrate 11. The beginning and terminal ends of theconductor 5 are wound onto connecting terminals 41 with a winding deviceor by hand, and then soldered to the terminals 41.

[0099] The coil pattern for the coil 53 may be any of rectangular,circular and elliptic spiral patterns as shown in FIGS. 6A to 6C. Thecoil 53 may be a pair of coils that are different in direction ofrectangular spiral winding and connected to each other, as shown in FIG.6D.

[0100] After the primary coil 53 is laid on the adhesive layer 52 asdescribed above, a double-sided adhesive tape 54 serving as an adhesivelayer (second adhesive layer) such as one manufactured by TeraokaSeisakusho [#7021 or #769] is, as shown in FIG. 5C, stuck on the primarycoil 53. Then, as shown in FIG. 5D, a wire conductor 5, for example, a0.05 mm UEW that is a copper wire with an insulating coating is laid onthe adhesive layer 54 in a predetermined coil pattern, to thereby form asecondary coil 55. In forming the secondary coil 55, the horizontalmovement of the wiring head 2 is controlled in association with theposition of the primary coil 53, so that the secondary coil 55 isarranged in a facing relation with the primary coil 53. Then, thebeginning and terminal ends of the conductor 5 of the secondary coil 55are connected to connecting terminals 41 as in the case of the primarycoil 53.

[0101] In a case where the secondary coil 55 is formed with use of aconductor 5 having a wire diameter different from that of the conductor5 for the formation of the primary coil 5, it is desirable to prepareand selectively use two wiring heads 2 or two wiring head nozzles 24 (or32), which are respectively suited to the conductors 5 having differentwire diameters, in laying the coils 53, 55. In the case of a wiringapparatus of the aforementioned type having a plurality of wiring heads2 or nozzles that can be used selectively, there is no need of setting aconductor to the wiring head 2 or the nozzle 24, 32 each time aconductor 5 to be laid is changed, whereby troublesome work such asinserting a conductor 5 can be eliminated and the efficiency of wiringcan be improved.

[0102] As shown in FIG. 5E, a second ferrite core 56 having, forexample, an E-shaped cross section is fitted on the secondary coil 55from above, so that the first and second ferrite cores 51, 56 aremagnetically coupled. Then, as shown in FIG. 5F, an adhesive tape 57 foruse in fixation, for example, an adhesive tape [#760] manufactured byTeraoka Seisakusho is wound on the circumferential face of the secondcore 56 and the rear side of the glass epoxy substrate 40, therebycombining the cores 51, 56.

[0103] In the planar transformer manufactured as above, the primary andsecondary coils 53, 55, which have been laid by the wiring head 2 on theadhesive layers 52, 54 two-dimensionally in the predetermined coilpatterns, are arranged opposite to and close to each other, with theadhesive layer 54 interposed therebetween. Further, the primary andsecondary coils 53, 55 are arranged close to the first and secondferrite cores 51, 56, respectively, and the cores 51, 56 form a magneticpath surrounding the primary and secondary coils 53, 55. Thus, theplanar transformer having the coils 53, 55 securely magnetic-coupled canbe formed easily. Since the distance between adjacent coil-parts or coilsections, the number of turns and the like in the patterned coil can bedetermined as desired, coils of different requirements can bemanufactured with ease and high precision. Further, the distance betweencoil-parts can be made small enough, resulting in an improved couplingefficiency.

[0104] Although the primary and secondary coils 53, 55 are provided intwo layers in this example, another coil may be laid further. It is alsopossible to form the secondary coil on the first ferrite core 51 andthen form the primary coil thereon, with the adhesive layer 54interposed therebetween. In other words, the primary and secondary coilsmay be formed in the reverse order.

[0105] In the planar transformer, the beginning and terminal ends ofeach coil 53, 55, which is made of a copper wire with an insulatingcoating, are extended across the coil to the outside, to be connected tothe connecting terminals 41. Thus, without using an advanced connectingtechnique requiring the provision of through-holes or the like, anelectrical connection between the coils 53, 55 can be securelyestablished, escaping troubles such as a short circuit.

[0106] Preferably, a triple insulated winding wire such as wiresmarketed under the trade names “TEX-E” and “TEXE-LZ” is used as at leastone of the wire conductors 5 for the coils 53, 55. The triple insulatedwinding wire of this kind has a function of reinforced insulation andmeets the safety standards such as IEC60950 and IEC60065. By using thetriple insulated winding wires to form the coils 53, 55, a transformerwith an improved insulation between the coils 53, 55 can bemanufactured, even when a substrate on which the coils 53, 55 are stuckis made of a single sheet whose insulating capability is notsufficiently high. This contributes to downsizing the transformer.

[0107] In the case of planar coils comprised of a copper wire with aninsulating coating, it is possible to lay a planar coil by utilizingspaces between coil-parts of another planar coil. For example, as shownin FIG. 7, a planar coil formed of an enameled wire can be laid betweencoil-parts of another planar coil that is formed of a litz wire. When aplurality of planar coils are laid on the same substrate 11 utilizingspaces between coil-parts in this manner, the magnetic coupling betweenthe coils can be improved sufficiently. Thus, a transformer having adesired performance and a reduced height can be easily manufactured.

[0108] When enameled wires are employed for the manufacture of atransformer that meets the international standard regarding the safetyof information equipment (IEC60950), three or more insulating layersmust be provided between the coils 53, 55 so as to improve insulationtherebetween. If such an insulating layer is constituted by a singleinsulator, the thickness of the insulating layer must have 0.4 mm ormore. To easily attain improved insulation to meet the internationalstandard, an insulating layer of a three-layer structure may beemployed. This insulating layer is comprised of adhesive insulatingtapes (adhesive layer 54) and an insulating tape affixed thereto. Theformer insulating tapes each have an insulating layer and provide arequired withstand voltage, whereas the latter insulating tape has oneinsulating layer. For example, each of the adhesive layers 51, 54 may becomprised of three adhesive insulating tapes which are stacked in threelayers one another and each of which is comprised of a polyester tapehaving a thickness of 25 μm and a required withstand voltage and havingboth sides thereof provided with adhesive layers. In this case, thethickness of each adhesive layer 51, 54 can be about 0.1 mm. This can bemuch help in making a planar coil thinner, meeting the safety standardsufficiently.

[0109] Further, a plurality of planar coils each having both sidesthereof provided with two-layer adhesive insulating tapes may be stackedone another, to obtain a unit that meets the safety standard easily. Forexample, a planar coil unit may be obtained by stacking two adhesiveinsulating tapes on a planar coil that is formed on a substrate 11 of atwo-layer structure comprised of two adhesive insulating tapes. Theplanar coil unit has such a sandwich structure that the planar coilprovided at its upper and lower sides with two-layer adhesive insulatingtapes. In the case of a transformer comprised of an arbitrary number ofthe just-mentioned planar coil units of sandwich structure which arestacked one another, four insulating layers are positively providedbetween adjacent planar coils, whereby an improved insulation tosufficiently meet the safety standard can be provided easily.

[0110] In this embodiment, the wiring head 2 moves up and down at apredetermined frequency, while making a horizontal motion along thesurface of the substrate. In other words, both the motions of the wiringhead 2 are not associated with each other. Alternatively, these motionsof the wiring head 2 may be associated with each other.

[0111] For example, the horizontal movement and the up-and-down motionof the wiring head 2 can be associated such that the wiring head 2starts the horizontal movement for each wire conductor section when thewiring head 2 starts moving up, and finishes it when the wiring head 2finishes moving down. The term “wire conductor section” indicates a wireconductor portion drawn out from the wiring head 2 during one cycle ofthe up-and-down motion of the wiring head 2. The up-and-down motion ofthe wiring head 2 can be considered as being performed for each wireconductor section, while the horizontal movement as being comprised of aseries of horizontal motions for a series of conductor sections. In casethat the horizontal movement of the wiring head 2 for each conductorsection is associated with the up-and-down motion as described above, agiven one section of the wire conductor 5 is drawn out from the wiringhead during a corresponding one cycle of up-and-down motion of thewiring head 2, and the same time the horizontal movement of the wiringhead 2 associated with that conductor section is carried out, wherebythe one conductor section is disposed on the surface of the substrateand is strongly stuck at its terminal end thereon. The horizontalmovement and the up-and-down motion of the wiring head 2 are made forall the wire conductor sections, so that the wire conductor 5 isstrongly stuck on the substrate surface point by point. Thus, the entirewire conductor 5 is stuck on the surface of the substrate. The series ofhorizontal movements is performed by controlling the two-dimensionalmovement of the wiring head 2 by means of point-to-point controltechnique, for example. In a control program for the point-to-pointcontrol, target positions for the wiring head 2, for each wire conductorsection, are programmed in accordance with the wiring pattern.

[0112] Next, with reference to FIGS. 8A to 8E, an IC card manufacturingmethod according to a second embodiment of the present invention will bedescribed.

[0113] In the IC card manufacturing method, as shown in FIG. 8A, adouble-sided adhesive sheet 61 with a separating sheet 62 on its rearside is prepared, and electrical components are stuck on the exposedadhesive surface of the double-sided adhesive sheet 61 [first step]. Theelectrical components include, for example, a semiconductor chip (ICchip) 63 such as a semiconductor integrated circuit device, a chipresistor, a chip capacitor, a land comprised of a circular patternedconductor and serving as a connecting terminal.

[0114] The double-sided adhesive sheet 61 is comprised of, for example,a flexible film in the form of a sheet, which film comprises a base(supporting base) of polyester or polyimide and an adhesive layer(adhesive surface) provided thereon, such as a thermosetting rubberadhesive layer, an acrylic adhesive layer, a silicone adhesive layer orthe like. If a sheet having a smaller thickness is desired, a baselessdouble-sided adhesive sheet (sheet consisting only of adhesive layers)manufactured by Teraoka Seisakusho [#7021] may be used, for example.

[0115] The separating sheet 62 is separably provided on one of theadhesive layers formed on both sides of the base of the adhesive sheet61. In the case of an adhesive sheet consisting only of an adhesivelayer, the separating sheet 62 is separably provided on one side of theadhesive layer.

[0116] On the adhesive surface of the double-sided adhesive sheet 2 onwhich the electrical components including the IC chip 3 have been stuckin first step, a wire conductor 5, for example, a polyurethane coatedwire conductor of 0.14 mm diameter is laid to form an antenna coil 64 ofa predetermined pattern, as shown in FIG. 8A [second step]. The wireconductor 5 is laid using, for example, the wiring apparatus shown inFIG. 1. In FIG. 8A, only a wiring head 2 of a wiring apparatus is shown.Illustration or indication of the whole wiring apparatus is omitted.

[0117] After the antenna coil 64 is formed in second step, the wireconductor 5 (antenna coil 64) is electrically connected by soldering thebeginning and terminal ends thereof to terminals of the IC chip 63, asshown in FIG. 8B [third step]. If the electrical components such as theIC chip 63 which have been stuck on the double-sided adhesive sheet 61need to be wired, an electric wiring pattern, i.e., a conductor patternfor electrical connection between electrical components is formed inaddition to the antenna coil 64.

[0118] In case that the wire conductor 5 for the antenna coil 64 and thewire conductor 5 for the electric wiring pattern are of different kinds,the electric wiring pattern is formed, for example, as follows: Afterthe antenna coil 64 is formed and the beginning and terminal endsthereof are soldered to the IC chip 63, the wire conductor 5 is replacedby the wire conductor 5 for the electric wiring pattern. Then, thelatter wire conductor 5 is laid to form the electric wiring pattern,i.e., the conductor pattern for electrical connection, as in the case offorming the antenna coil 64, and the conductor pattern is soldered toterminals of the IC chip 63 and the like and lands. In summary, firstand second steps are carried out using the wire conductor 5 for theelectric wiring pattern.

[0119] As described above, a predetermined functional circuit (body ofthe IC card) as shown in FIG. 8B is formed by placing electricalcomponents such as the IC chip 63 and forming the antenna coil 64 on theadhesive surface of the double-sided adhesive sheet 61. Then, as shownin FIG. 8C, a first card substrate 65 is stuck on the upper surface ofthe double-sided adhesive sheet 61 [fourth step]. Thereafter, as shownin FIG. 8D, the separating sheet 62 provided on the rear side of thedouble-sided adhesive sheet 61 is separated, and a second card substrate66 is stuck on the thus exposed rear-side adhesive surface [fourthstep].

[0120] The card substrates 65, 66 are made of PVC (polyvinyl chloride),PET (polyethylene terephthalate) or the like. It is desirable to use thecard substrates 65, 66 a little larger in outer dimensions than thedouble-sided adhesive sheet 61, so that both card substrates may becombined by spot-welding their peripheral portions with the double-sidedadhesive sheet 61 placed therein. Thus, as shown in FIG. 8E, an IC cardis completed with the double-sided adhesive sheet 61 sandwiched betweenthe card substrates 65, 66.

[0121] If the card substrates 65, 66 and the double-sided adhesive sheet61 sandwiched therebetween are the same in outer dimensions and formedinto a unit, it is desirable to protect the double-sided adhesive sheet61 by coating all the four end faces of the unit with resin, or bylaminating the whole unit with plastic.

[0122] According to the above-described IC card manufacturing methodwhere an antenna coil 64 is formed and electrical connection isestablished between the antenna coil 64 and an IC chip 63 stuck on theadhesive sheet 61 and between electrical components by laying a wireconductor 5 on a double-sided adhesive sheet 61, the process ofmanufacturing IC cards can be simplified, contributing a reduction inmanufacturing cost of IC cards. Since the wire conductor 5 is laiddirectly on the double-sided adhesive sheet 2, it is easy to denselyarrange the coil-parts of the antenna coil 64. Especially when a copperwire with an insulating coating is used as the wire conductor 5, theantenna coil 64 can be formed with its coil-parts being in closelycontact with one another, thereby making it possible to improve antennacharacteristics. The antenna coil thus formed is satisfactory in respectof bending strength and tensile strength, unlike the antenna coil 64formed by plating or printing, and is free from fatigue breakage, whichmay occur to a wire conductor laid using ultrasonic vibration. Thus,reliable IC cards can be manufactured easily, steadily and at low cost.

[0123] Further, the card substrates 65, 66 can be combined easily,making use of adhesiveness of the double-sided adhesive sheet 61. Thus,the manufacturing process can be made simpler.

[0124] The present invention is not limited to the above-described firstand second embodiments.

[0125] For example, the first embodiment was described taking an exampleof forming a planar coil on an adhesive tape. However, the presentinvention can be applied to forming a desired wiring pattern on aninsulated circuit substrate of, for example, paper.phenol, paper.epoxy,glass.epoxy or the like. In that case, silicone adhesive, acrylicadhesive, or rubber adhesive may be directly applied on the insulatedcircuit substrate. Alternatively, a double-sided adhesive tape appliedwith adhesive may be stuck on the insulated circuit substrate. Thesubstrate is not limited to a rigid one, but may be a flexible one.

[0126] In place of an adhesive layer having adhesiveness in an roomtemperature, a pressure sensitive adhesive layer may be used, whichexhibits adhesiveness when a pressing force is applied by the wiringhead 2. Further, a UV (ultraviolet) curing adhesive layer may be used,so that a planar coil or the like may be securely embedded in theadhesive layer by curing the adhesive layer by applying ultraviolet raysafter forming the planar coil or the like. Furthermore, thermosettingadhesive may be used.

[0127] The wiring pattern and the pitch of the wiring pattern may bedetermined based on the requirements of a product such as a planar coil.Needless to say, a plurality of planar coils may be formed into amulti-layer structure (laminated structure). The frequency and stroke ofthe up-and-down motion of the wiring head, the speed of horizontalmovement of the wiring head, and the like may be determined based on thediameter of a wire conductor and the like. When the up-and-down motionof the wiring head is synchronized with the horizontal movement of thewiring head 2, the horizontal movement of the wiring head may beprohibited while the wiring head is pressed on the substrate, byproviding a torque limiter in the driving mechanism for the XY table.Needless to say, a variety of already proposed mechanical or electricalsynchronizing means can be applied to the present invention. However,practically, the apparatus can work satisfactorily without a particularsynchronizing means, if the up-and-down motion of the wiring head 2 ismade at a speed sufficiently faster than that of the horizontal movementof the wiring head 2.

[0128] Regarding the frequency of the up-and-down motion of the wiringhead, it is practically enough to determine the same to have a valuewithin the range of about 1.5 Hz to about 500 Hz, while taking accountof the feed speed of the wire conductor and the like. Further, a varietyof already proposed reciprocating techniques can be applied to means forhorizontally moving the wiring head and the like. Further, the substratemay be moved horizontally, in place of moving the wiring headhorizontally. In that case, the substrate may be supported on an XYtable.

[0129] The pattern and the layer structure for a planar coil to beformed by the wiring method of the present invention may be determinedbased on the requirements of the coil.

[0130] As for the up-and-down motion of the wiring head 2, the tip ofthe nozzle of the wiring head is not required to be brought in contactwith the surface of the substrate, as long as a wire conductor drawn outfrom the tip of the nozzle can be brought into point contact with thesubstrate surface and securely stuck thereon. Further, the frequency ofthe up-and-down motion does not need to be constant. That is, the wiringhead may be moved up and down in accordance with the curvature, thelinear length and the like of a concerned portion of the wiring pattern.Further, the substrate may be moved up and down, in place of moving thewiring head up and down.

[0131] In the second embodiment, a card substrate was stuck on each sideof a double-sided adhesive sheet. However, an IC card can bemanufactured having a card substrate stuck only on that adhesive surfaceof an adhesive sheet on which electrical components and an antenna coilare stuck and formed, respectively. Further, electrical components andan antenna coil may be stuck and formed, respectively, on an uppersurface of a double-sided adhesive sheet, after a card substrate isstuck on the rear side of the double-sided adhesive sheet.

[0132] The second embodiment was described, taking an example ofmanufacturing an IC card provided with an antenna coil. The presentinvention can be also applied to manufacturing an IC card not providedwith an antenna coil. In that case, a wire conductor for connectingelectrical components is laid on an adhesive sheet.

[0133] Other various modifications can be made to the present inventionwithout departing from the principle thereof.

1. A wiring method comprising the steps of: (a) forming an adhesivelayer on a surface of a substrate; and (b) sticking a wire conductor onthe surface of the substrate by causing a three-dimensional relativemovement between the substrate and a wiring head adapted to guide thewire conductor such that the wiring head relatively moves along theadhesive layer formed on the surface of the substrate and the wiringhead and the adhesive layer intermittently come close to each other forpoint contact.
 2. A wiring method according to claim 1 , wherein thethree-dimensional relative movement between the wiring head and thesubstrate executed in said step (b) includes a relative translationalmotion between the wiring head and the substrate which is performedalong the adhesive layer, and a relative reciprocal motion between thewiring head and the substrate which is performed in a direction ofthickness of the substrate.
 3. A wiring method according to claim 1 ,wherein the wire conductor supplied to the wiring head is drawn out fromthe wiring head by the three-dimensional relative movement between thewiring head and the substrate executed in said step (b).
 4. A wiringmethod according to claim 1 , further comprising the steps of: (c)providing a second adhesive layer on the wire conductor stuck on thesurface of the substrate; and (d) sticking a second wire conductor onthe second adhesive layer by causing a three-dimensional relativemovement between the substrate and the wiring head adapted to guide thesecond wire conductor, such that the wiring head relatively moves alongthe second adhesive layer and the wiring head and the second adhesivelayer intermittently come close to each other for point contact.
 5. Awiring method according to claim 4 , wherein: the three-dimensionalrelative movement between the wiring head and the substrate executed insaid step (b) includes a relative translational motion between thewiring head and the substrate which is performed along the adhesivelayer, and a relative reciprocal motion between the wiring head and thesubstrate which is performed in a direction of thickness of thesubstrate, the relative translational motion being executed inaccordance with a first two-dimensional pattern, so that a firstwire-conductor pattern corresponding to the first two-dimensionalpattern is formed on the surface of the substrate; in said step (c), thesecond adhesive layer is formed on the first wire-conductor pattern; andin said step (d), a relative translational motion between the substrateand the wiring head adapted to guide the second wire conductor isexecuted in accordance with a second two-dimensional pattern, so that asecond wire-conductor pattern corresponding to the secondtwo-dimensional pattern is formed on the second adhesive layer.
 6. Awiring method according to claim 4 , wherein in said step (c), anadhesive sheet is stuck on the first wire-conductor pattern to form thesecond adhesive layer.
 7. A wiring method according to claim 4 , whereinconductors with an insulating coating are used as the wire conductor andthe second wire conductor.
 8. A wiring apparatus, comprising: asupporting mechanism for supporting a substrate having a surface thereofprovided with an adhesive layer; a wiring head for guiding a wireconductor, said wiring head being arranged for reciprocal motion betweena close position in which said wiring head can be in point contact withsaid adhesive layer formed on the surface of the substrate and a distantposition in which said wiring head is most distant from the adhesivelayer; a moving mechanism for causing a relative translational motionbetween said wiring head and said substrate such that said wiring headrelatively moves along the surface of the substrate; and control meansfor controlling an operation of said moving mechanism.
 9. A wiringapparatus according to claim 8 , wherein said control means controls theoperation of said moving mechanism in accordance with a wiring patternfor laying said wire conductor on said substrate.
 10. A wiring apparatusaccording to claim 8 , wherein said wiring head has a nozzle for guidingsaid wire conductor, and when said wiring head is in said closeposition, a tip of said nozzle is positioned close to said adhesivelayer, formed on the surface of said substrate, for point contacttherewith.
 11. A wiring apparatus according to claim 8 , wherein saidwiring head has a nozzle formed with a nozzle hole for guiding said wireconductor, said nozzle hole extending parallel to the direction ofreciprocation of said wiring head.
 12. A wiring apparatus according toclaim 8 , wherein said moving mechanism includes a first table arrangedfor reciprocal motion relative to said supporting mechanism, and asecond table for supporting said wiring head, said second table beingarranged for reciprocal motion in a direction perpendicular to an axisalong which said first table is reciprocated.
 13. A wiring apparatusaccording to claim 8 , wherein said wiring head includes a supportingportion mounted to said moving mechanism, a shaft portion supported forreciprocal motion by said supporting portion, a nozzle for guiding saidwire conductor, said nozzle being attached to said shaft portion on aside thereof facing the surface of the substrate, an eccentric camrotatably supported by said supporting portion, and a cam followerattached to said shaft portion on a side thereof remote from the surfaceof the substrate and disposed in contact with a cam face of saideccentric cam.
 14. A wiring apparatus according to claim 13 , wherein aplurality of nozzles are detachably attached to said shaft portion ofsaid wiring head.
 15. A wiring apparatus according to claim 8 , whereinsaid wiring head includes a head body mounted to said moving mechanism,a nozzle for guiding said wire conductor, said nozzle being supported bysaid head body for reciprocal motion and for point contact with saidadhesive layer formed on the surface of said substrate, a pressingmember supported by said head body for reciprocal motion and for pointcontact with said adhesive layer, first and second permanent magnetsattached to said nozzle and said pressing member, respectively, andhaving different directions of magnetism, and an electromagnet attachedto said head body for electromagnetic interaction with said first andsecond permanent magnets.
 16. An IC card manufacturing method comprisingthe steps of: (a) sticking an electrical component on an adhesive sheet;(b) laying a wire conductor on said adhesive sheet by causing a relativemovement between said adhesive layer and a wiring head adapted to guidesaid wire conductor such that said wiring head relatively moves along asurface of said adhesive sheet and said wiring head and said adhesivesheet intermittently come close to each other for point contact; (c)electrically connecting each end of said wire conductor to saidelectrical component; and (d) sticking said adhesive sheet and a cardsubstrate together.
 17. An IC card manufacturing method according toclaim 16 , wherein in said step (d), a first card substrate is stuck ona first surface of said adhesive sheet on which said electricalcomponent is stuck, and a second card substrate is stuck on a secondsurface of said adhesive sheet.
 18. An IC card manufacturing methodaccording to claim 16 , wherein: in said step (a), said electricalcomponent is stuck on an exposed first adhesive surface of adouble-sided adhesive insulating sheet having a second adhesive surfacethereof provided with a separating sheet; in said step (b), said wireconductor is laid on said exposed first adhesive surface of saiddouble-sided adhesive sheet; and in said step (d), said first cardsubstrate is stuck on said exposed first adhesive surface of saiddouble-sided adhesive sheet, said separating sheet is separated fromsaid second adhesive surface of said double-sided adhesive sheet, andthen said second card substrate is stuck on said second adhesivesurface.
 19. An IC card manufacturing method according to claim 16 ,wherein in said step (b), an antenna coil is formed on said adhesivesheet by laying said wire conductor in a predetermined pattern on saidadhesive sheet.
 20. An IC card manufacturing method according to claim16 , wherein in said step (a), at least one of a semiconductor chip, achip resistor, a chip capacitor and a terminal is stuck on said adhesivesheet as said electrical component.
 21. An IC card manufacturing methodaccording to claim 16 , wherein: in said step (a), a plurality ofelectrical components are stuck on said adhesive sheet; in said step(b), at least one electric wiring pattern is formed on said adhesivesheet by laying said wire conductor in a predetermined pattern on saidadhesive sheet; and in said step (c), said electric wiring pattern iselectrically connected with relevant ones of said plurality ofelectrical components.